Silicon Pore Optics
Material
The Silicon Pore Optics approach uses commercial, high-quality 1mm thick silicon wafers as a base material. The latest generation silicon wafers have a surface roughness that is sufficiently low for X-ray reflection, are plane parallel to better than a micrometer, have almost perfect mechanical properties, and are considerably cheaper than other high-quality optical materials.
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Assembly
- The process starts by taking 6-cm-wide rectangular cuts of wafers and treating the backside with a chemo-mechanical process such that ribs remain with a very accurate height and a highly polished surface.
- One side of the segment is then structured via etching with accurately wedged ribs approximately 1 mm apart. The other side is coated with X-ray reflecting metallic layer.
- The ribbed plates are then stacked onto a cylindrical mandrel, forming a pore structure.
- To stack the plates, they are bent into a cylindrical shape with the required radius, and then pressed onto the previous plate. This results in a direct optical bond between the highly polished ribs and the surface of the previous plate.
- After the stack is built it can be raised in temperature to turn it (partially) into a true covalent bond.
Two stacks are co-aligned into a module forming an approximation of a paraboloid-hyperboloid mirror. The radial ribs of the pore structure provide extreme stiffness and stability and therefore allow the walls to be thin. The accurate height of the ribs, a direct result of the good plan-parallelism of the wafers, ensures that the plates are accurately concentric cylindrical or conical surfaces.
- A total of 236 modules form a "petal"—an azimuthal segment of the full mirror.
- Eight such petals form the complete mirror.
- Hard X-ray sensitivity is provided by coating reflecting surfaces at the innermost radii with multi layers.
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An automated optical assembly system was developed and placed in a class-100 clean room environment. The system is fully computer-controlled and has a number of actuators, some of them nano-actuators, an interferometer, digital microscopes with real time image analysis, and force sensors.
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